SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Huawei released the world's first Bluetooth 5.1 and BLE 5.1 wireless chip for wearable applications
  • 0

Huawei released the world's first Bluetooth 5.1 and BLE 5.1 wireless chip for wearable applications

SemiMediaEdit
September 9, 2019

On September 6th, Huawei released the world's first Bluetooth 5.1 & BLE 5.1 wireless chip, the Kirin A1, at the new product launch conference. The chip has excellent anti-interference ability and high-performance dual-channel Bluetooth connection, which reduces the delay by 30%, the transmission rate is increased by 2.8 times, providing high-definition, lossless sound quality for wireless headset applications.

In addition, at the press conference, Huawei also demonstrated its first wireless headset, the FreeBuds 3, equipped with the Kirin A1 chip, which is small in size and powerful in performance.

According to reports, Huawei FreeBuds 3 is designed with an open earplug that is ergonomic and comfortable to wear. Huawei FreeBuds 3 is the world's first true wireless headset with an open design that supports active noise reduction, effectively eliminating ambient noise.

Compared to Apple's AirPods 2, Huawei FreeBuds 3 charges faster, lasts longer and has a lower latency.

Related

BLE chip Bluetooth chip electronic components news HUAWEI
ON Semiconductor Supports Increasing Power Demands of IoT Endpoints with New Power over Ethernet (PoE) Solutions
Previous
JCET appoints NXP's former Greater China president as new CEO
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay launches new 1200 V SiC power modules for automotive and energy systems

Vishay launches new 1200 V SiC power modules for automotive and energy systems

December 4, 2025
0
ROHM launches high-speed RPR-0730 optical sensor for industrial and printing systems

ROHM launches high-speed RPR-0730 optical sensor for industrial and printing systems

December 3, 2025
0
Vishay Launches 1500V Automotive-Grade Solid-State Relay for Battery Management Systems

Vishay Launches 1500V Automotive-Grade Solid-State Relay for Battery Management Systems

November 28, 2025
0
Nexperia Netherlands calls for immediate dialogue with Nexperia China to resolve supply chain disruptions

Nexperia Netherlands calls for immediate dialogue with Nexperia China to resolve supply chain disruptions

November 28, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator