SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Huawei released the world's first Bluetooth 5.1 and BLE 5.1 wireless chip for wearable applications
  • 0

Huawei released the world's first Bluetooth 5.1 and BLE 5.1 wireless chip for wearable applications

SemiMediaEdit
September 9, 2019

On September 6th, Huawei released the world's first Bluetooth 5.1 & BLE 5.1 wireless chip, the Kirin A1, at the new product launch conference. The chip has excellent anti-interference ability and high-performance dual-channel Bluetooth connection, which reduces the delay by 30%, the transmission rate is increased by 2.8 times, providing high-definition, lossless sound quality for wireless headset applications.

In addition, at the press conference, Huawei also demonstrated its first wireless headset, the FreeBuds 3, equipped with the Kirin A1 chip, which is small in size and powerful in performance.

According to reports, Huawei FreeBuds 3 is designed with an open earplug that is ergonomic and comfortable to wear. Huawei FreeBuds 3 is the world's first true wireless headset with an open design that supports active noise reduction, effectively eliminating ambient noise.

Compared to Apple's AirPods 2, Huawei FreeBuds 3 charges faster, lasts longer and has a lower latency.

Related

BLE chip Bluetooth chip electronic components news HUAWEI
ON Semiconductor Supports Increasing Power Demands of IoT Endpoints with New Power over Ethernet (PoE) Solutions
Previous
JCET appoints NXP's former Greater China president as new CEO
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ADI rolls out A²B 2.0 for automotive audio with higher bandwidth

ADI rolls out A²B 2.0 for automotive audio with higher bandwidth

May 1, 2026
0
Nexperia China says operations stable after parent risk warning

Nexperia China says operations stable after parent risk warning

April 30, 2026
0
TDK rolls out compact DC-DC modules for industrial and chip equipment

TDK rolls out compact DC-DC modules for industrial and chip equipment

April 30, 2026
0
PCB prices rise on supply disruptions and AI demand

PCB prices rise on supply disruptions and AI demand

April 29, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator