SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › JCET appoints NXP's former Greater China president as new CEO
  • 0

JCET appoints NXP's former Greater China president as new CEO

SemiMediaEdit
September 10, 2019

On September 9, China's largest OSAT (outsourcing semiconductor assembly and testing) service provider and discrete device manufacturer Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET) announced the appointment of Zheng Li as chief executive and nominated as a director. Former CEO Dr. Choon Heung Lee will continue to serve as the company's chief technology officer and continue to work on the company's development.

Zheng Li has over 26 years of working experience in the IC industry. Prior to joining JCET, Mr. Zheng Li served as Senior Vice President and President of Greater China at NXP. He also served as CEO of Renesas Electronics Greater China and Senior Vice President of Global Markets at SMIC.

Mr. Zheng Li received his bachelor's degree in industrial management engineering from Tianjin University and his master's degree in financial economics from the University of Tokyo, Japan. He is also a member of the China Semiconductor Industry Association and an adjunct professor at the Department of Microelectronics of Tianjin University.

Related

electronic components news JCET CEO NXP
Huawei released the world's first Bluetooth 5.1 and BLE 5.1 wireless chip for wearable applications
Previous
NXP launches microcontrollers for IoT edge face and voice biometrics
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Amkor expands Arizona packaging plans as AMD joins advanced packaging customers

Amkor expands Arizona packaging plans as AMD joins advanced packaging customers

May 22, 2026
0
Vishay launches automotive-grade optocouplers for EV and high-voltage isolation systems

Vishay launches automotive-grade optocouplers for EV and high-voltage isolation systems

May 22, 2026
0
Infineon expands CoolGaN BDS portfolio with compact 40 V bidirectional GaN switches

Infineon expands CoolGaN BDS portfolio with compact 40 V bidirectional GaN switches

May 21, 2026
0
Samsung Electronics reaches last-minute labor deal ahead of planned strike

Samsung Electronics reaches last-minute labor deal ahead of planned strike

May 21, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator