SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Nexperia secures $1,500M financing to fund future growth plans
  • 0

Nexperia secures $1,500M financing to fund future growth plans

SemiMediaEdit
September 6, 2019

Nexperia yesterday announced the successful raise of USD 1,500 million equivalent of senior credit facilities. The proceeds will be used to refinance the existing outstanding debt and to partly finance the acquisition by Wingtech Technologies Co., Ltd., a listed Chinese computer and telecom equipment manufacturer.

The facilities were arranged and underwritten by ABN AMRO, Bank of America Merrill Lynch and HSBC acting as Global Coordinators and were syndicated to a group of twelve global banks in total. The refinancing is fully supported by Wingtech and provides a flexible financing package at very attractive terms to support the further growth of Nexperia going forward.

Nexperia is a Netherlands-headquartered, global manufacturer of discrete semiconductor components. As a result of the Wingtech acquisition, the company is expected to capture long-term growth trends in China, further enhancing its revenues.

 

Editor's note: The source of this post is the official statement of Nexperia

Related

electronic components news Nexperia Wingtech
Nordic Semiconductor expands distribution network in India
Previous
ON Semiconductor Supports Increasing Power Demands of IoT Endpoints with New Power over Ethernet (PoE) Solutions
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

June 12, 2025
0
Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

June 11, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator