According to reports, China's Yangtze Memory Technologies Co., Ltd. (YMTC) expects to mass-produce 64-layer stack 3D NAND flash by the end of this year and 128-layer stack 3D NAND flash memory by 2020.
Founded in July 2016 in Wuhan, China, YMTC is an IDM memory company specializing in the design, manufacture and sale of 3D NAND flash memory chips. YMTC provides storage products for industrial and commercial customers worldwide, and is widely used in mobile devices, computers, data centers and consumer electronics.
YMTC mass-produced 32-layer stack 3D NAND flash memory last year, but the output was very small, which is experimental, mainly used for low-end products such as USB flash disk.
YMTC mass-produced 32-layer stack 3D NAND flash memory last year, but it was experimental mass production, mainly used for low-end products such as U disk.
In 3D NAND flash technology, YMTC independently developed Xtacking 3D stack technology. It is expected to officially mass-produce 64-layer stack 3D NAND flash memory by the end of this year, and It will gradually increase production capacity next year. According to estimates, it is expected that the production capacity will be increased to 60,000 wafers per month by the end of 2020.
By 2020, YMTC will launch a 128-layer stack of 3D flash memory, which will allow TMTC to technically shorten or even catch up with the industry giant.