ROHM Semiconductor recently announced an ultra-compact 1.6x1.6mm size MOSFET family, the RV4xxx, which is AEC-Q101 compliant to ensure automotive-grade reliability and performance in extreme conditions. ROHM's original packaging processing technology enables miniaturization of high quality automotive components such as ADAS camera modules.

In recent years, an increasing number of vehicle safety and convenience systems (such as ADAS cameras) have emphasized the challenges of limited space to accommodate these systems and to stimulate demand for smaller components. In order to meet such a demand, a bottom electrode type MOSFET which can be miniaturized while maintaining a high current is attracting attention.

However, for automotive applications, optical inspection is performed during assembly to ensure quality, but in the case of the bottom electrode assembly, the solder height cannot be verified after installation, making it difficult to confirm the mounting conditions.

The RV4xxx series has made ROHM the first in the industry to introduce a product with the original wettable planar forming technology to ensure the package side (130μm) electrode height required for vehicle applications. In addition, the compact bottom electrode MOSFETs of this series reduce the mounting space.

Samples of this series are already available and will be in volume production in September. For more information on this series, please visit ROHM Semiconductor's website: