SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › NXP announces ultra-wideband technology
  • 0

NXP announces ultra-wideband technology

SemiMediaEdit
July 5, 2019

Recently, NXP announced the introduction of ultra-wideband (UWB) technology, which was previously used for various short-range communications, and NXP will use UWB to enhance secure access through localization, targeting key cards and car networking.

NXP utilizes a 500MHz channel in the 6 GHz to 10 GHz range to protect it from narrowband channel fading. UWB utilizes pulse transmission at specific time intervals, so the system can use the transmitted information to determine flight time and direction information, with the result that the system can determine the exact location of the transmission by determining the distance and angle of arrival. It also prevents interception and retransmission of information in so-called Man-in-the-Middle (MITM) attacks due to transmission timing to specific intervals. NXP is leveraging these aspects of UWB to provide security systems for automotive and IoT applications.

The industry believes that NXP's technology is based on its expanding wireless technology development capabilities. NXP's acquisition of Marvell's Wi-Fi and Bluetooth technology has undoubtedly enhanced its wireless technology solutions.

Currently, NXP has not revealed further features of the technology or application. But no doubt, NXP is steadily consolidating its position as a leader in IoT field.

Related

NXP ultra-wideband technology
SEMI: Trade wars have limited impact on the semiconductor industry
Previous
Microchip opens new R&D center in Chennai
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

NXP releases 10BASE-T1S PMD transceivers for edge Ethernet

NXP releases 10BASE-T1S PMD transceivers for edge Ethernet

February 26, 2026
0
SK hynix says memory market turns seller-driven, prices seen rising through 2026

SK hynix says memory market turns seller-driven, prices seen rising through 2026

February 24, 2026
0
Infineon rolls out isolated gate drivers to support next wave of SiC power systems

Infineon rolls out isolated gate drivers to support next wave of SiC power systems

February 12, 2026
0
ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

February 11, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator