SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Xilinx announces cooperation with ZF Group
  • 0

Xilinx announces cooperation with ZF Group

SemiMediaEdit
January 10, 2019

Xilinx and ZF Friedrichshafen AG jointly announced a new strategic partnership, and Xilinx will accelerate the launch of autonomous driving applications by supporting ZF's highly advanced artificial intelligence (AI) automotive control unit ZF ProAI.

ZF is using the Xilinx Zynq® UltraScale+TMMPSoC platform to handle real-time data aggregation, pre-processing and distribution, while also providing computational acceleration for AI processing of its new AI electronic control unit. ZF chose this flexible, highly intelligent platform because it provides the ZF ProAI platform with the necessary processing power, scalability and flexibility to be tailored to each customer's unique needs.

Yousef Khalilollahi, vice president of core vertical markets at Xilinx, said: "We are proud to be able to work with ZF on the ProAI platform to help solve the challenges associated with driverless vehicle development. By providing a flexible hardware platform, ZF can Designing a flexible and scalable system that seamlessly integrates AI computing acceleration with functional safety (FuSa) with a diverse processing engine. We look forward to further expanding our collaboration with ZF to take autonomous driving and AI innovation to a new level ."

For more than 13 years, Xilinx has been supplying chips to automakers and Tier 1 automotive suppliers. Today, Xilinx has more than 160 million devices widely used in automotive systems, of which approximately 55 million are ADAS chips.

Related

cooperation electronic components news Xilinx ZF Group
Maxim Integrated introduces industry's smallest, most efficient buck converters and controllers
Previous
Avnet | Integrated SimplePlus
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK launches vibration-resistant hybrid polymer capacitors for automotive and industrial use

TDK launches vibration-resistant hybrid polymer capacitors for automotive and industrial use

December 12, 2025
0
Renesas launches RA6W Wi-Fi 6 MCUs and modules for low-power IoT applications

Renesas launches RA6W Wi-Fi 6 MCUs and modules for low-power IoT applications

December 11, 2025
0
Taiyo Yuden begins mass production of embeddable 100-μF MLCC for AI server power lines

Taiyo Yuden begins mass production of embeddable 100-μF MLCC for AI server power lines

December 10, 2025
0
TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges

TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges

December 9, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator