SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Molex releases EdgeLock wire-to-signal card connector
  • 0

Molex releases EdgeLock wire-to-signal card connector

SemiMediaEdit
August 2, 2018

Molex introduces the EdgeLock wire-to-signal card connector to ensure a direct and robust pairing of conductive contacts on the edge of the printed circuit board. This 2.00 mm pitch edge-lock connector saves space and reduces assembly time.

Molex releases EdgeLock wire-to-signal card connector-SemiMedia

The EdgeLock wire-to-signal card connector eliminates the need to pair the connector assembly, reducing assembly costs. Anti-missing ribs on the connector housing prevent incorrect mating to the printed circuit board (PCB). It also supports a maximum current of 3.0 amps. The double cantilever crimp terminal design features raised contacts for higher normal force and long-term electrical reliability.

System rework is also very convenient because the EdgeLock system uses a mortise lock to quickly remove components from the printed circuit board. The redesigned PA46 material is a low halogen material ideal for high temperature environments and applications.

Molex product manager Myung Gyu Kim said: "The consumer electronics and appliance industries want a secure connector system, and EdgeLock meets this requirement. The EdgeLock connector replaces the typical solder joint and provides a solid connection through the center. The blocking function also saves space."

Related

Electronic component news Molex wire-to-signal card connector
Allegro and UMC signs a long-term cooperation agreement
Previous
Advancing real-time health monitoring with Maxim Integrated Technology
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems

Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems

September 16, 2025
0
Silicon Labs launches FG23L wireless SoC to expand sub-GHz IoT market

Silicon Labs launches FG23L wireless SoC to expand sub-GHz IoT market

September 15, 2025
0
Kioxia to commercialize AI SSDs by 2027 in collaboration with Nvidia

Kioxia to commercialize AI SSDs by 2027 in collaboration with Nvidia

September 12, 2025
0
Nexperia launches AEC-Q100 multiplexers to boost reliability in automotive systems

Nexperia launches AEC-Q100 multiplexers to boost reliability in automotive systems

September 10, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator