April 6, 2026 /SemiMedia/ — According to SEMI, global 300mm wafer fab equipment spending is expected to grow strongly over the next several years, reaching $133 billion in 2026, up 18%, and $151 billion in 2027, up 14%.

The increase is driven by strong demand for AI chips in data centers and edge devices, alongside regional efforts to localize supply chains and strengthen semiconductor self-sufficiency. Ajit Manocha, SEMI’s president and CEO, said spending is expected to surpass $150 billion in 2027, reflecting the industry’s ongoing commitment to advanced production capacity and resilient supply chains.

By segment, the logic and microdevices sector is expected to lead investment, with total spending from 2027 to 2029 projected at $228 billion, supported by demand for leading-edge nodes below 2nm. The memory segment follows with an estimated $175 billion, including $111 billion for DRAM and $62 billion for 3D NAND, marking a new growth cycle for memory equipment.

Regionally, Mainland China, Taiwan region, Korea, and the Americas are projected to see the largest increases, while Japan, Europe, the Middle East, and Southeast Asia will also expand investment from smaller bases, achieving significant growth by 2029.