April 3, 2026 /SemiMedia/ — Japan-based Mitsubishi Gas Chemical (MGC) said it will raise prices by about 30% across its electronic materials portfolio starting April 1, covering copper clad laminates (CCL), prepreg materials and resin coated copper (CRS).

The company said higher raw material costs, rising labor expenses and increased logistics charges have weighed on margins in its electronic materials segment. The price adjustment is aimed at maintaining stable supply and supporting long-term operations.

CCL is a key material used in IC substrates, especially for high-performance processors such as CPUs, GPUs and AI chips. It serves as the core layer in substrate structures, providing mechanical support while affecting electrical performance, dimensional stability and heat dissipation.

As chip performance continues to improve, higher data speeds and increased heat output are pushing substrate materials to their limits. This is driving demand for higher-end CCL with better electrical and thermal properties.

The move follows a similar decision by Japan’s Resonac, which raised prices for CCL and related adhesive films by around 30% from March 1. Back-to-back increases from major suppliers suggest that cost pressure is building across Japan’s advanced electronic materials sector and may continue to pass through the semiconductor supply chain.