AI chip packaging

MGC raises semiconductor materials prices 30% as packaging material costs rise

MarketWatch

MGC raises semiconductor materials prices 30% as packaging material costs rise

April 3, 2026

TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges

Manufacturer

TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges

December 9, 2025

ASE to expand semiconductor packaging capacity in Malaysia and Kaohsiung

MarketWatch

ASE to expand semiconductor packaging capacity in Malaysia and Kaohsiung

February 19, 2025