January 16, 2026 /SemiMedia/ — TDK Corporation has introduced its ModCap UHP (B25648A) series of DC link capacitors, targeting high-power inverter systems built on silicon carbide (SiC) power semiconductors. The new capacitors are designed to operate continuously at hotspot temperatures of up to 105°C without power derating, addressing growing thermal challenges in next-generation power electronics.

Earlier ModCap designs required derating once temperatures exceeded 90°C. By using a new high-temperature dielectric material and a modular construction, the ModCap UHP series supports higher current density while extending operational lifetime. TDK said the capacitors are rated for up to 200,000 hours at 105°C, with current density around 20% higher than previous generations.

The series covers DC voltage ratings from 1,350 volts to 1,800 volts, with capacitance values between 470 microfarads and 880 microfarads. With an equivalent series inductance as low as 8 nanohenries, the capacitors are suited for high switching frequencies and low parasitic requirements common in SiC-based inverter designs.

TDK said the ModCap UHP is aimed at applications including renewable energy systems such as solar and wind power, electrolyzers, energy storage systems, railway auxiliary drives and industrial motor drives. Its cubic form factor allows easier busbar integration, helping designers increase power density in compact converter systems and reduce the need for additional snubber components.

On materials and safety, the capacitors use ISCC-certified bio-circular BOPP dielectric film, while the housing meets UL94 V-0 and EN 45545-2 HL3 R23 fire standards. UL certification is pending. TDK also provides engineering support tools such as SPICE models, the CLARA lifetime evaluation tool and CAP Thermal simulation software to assist system-level design. For more information, please visit www.tdk-electronics.tdk.com/en/modcap_power_capacitors