SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Arm reshapes business, creates physical AI unit to expand robotics and automotive push
  • 0

Arm reshapes business, creates physical AI unit to expand robotics and automotive push

SemiMediaEdit
January 9, 2026

January 9, 2026 /SemiMedia/ — Arm Holdings said it has reorganized its internal structure and created a new physical artificial intelligence division, a move designed to strengthen its position in robotics and automotive-related computing platforms.

Following the overhaul, Arm now operates across three main business lines: cloud and artificial intelligence, edge computing covering mobile devices and PCs, and physical AI, which includes automotive and robotics workloads. The shift reflects the company’s effort to align its processor architecture more closely with systems that interact directly with the physical world.

Robotics and automotive emerge as key physical AI applications

Executives said robotics and vehicles share a common foundation in sensors, control systems and real-time compute, making them natural targets for Arm’s expanding technology roadmap. Carmakers, including Tesla, have been developing robots to automate tasks in factories and warehouses, further blurring the line between automotive and industrial computing.

Long-term growth strategy extends beyond traditional CPU designs

The push into physical AI is part of a broader strategy under Chief Executive Rene Haas, who took over about four years ago. Arm has been working to raise the value of its latest architectures while also exploring whether to move closer to full chip design offerings, according to company executives.

Arm sees robotics as a long-term growth market. Drew Henry, who leads the company’s newly formed robotics team, said physical AI could materially improve productivity and have a meaningful impact on economic output. Chief Marketing Officer Ami Badani said Arm plans to hire more engineers dedicated to robotics-focused technologies.

Related

AI-powered autonomous machines Arm Physical AI division Real-world intelligent systems Robotics and automotive computing
ASE may raise packaging prices by 5%–20%, above prior expectations
Previous

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE may raise packaging prices by 5%–20%, above prior expectations

ASE may raise packaging prices by 5%–20%, above prior expectations

January 9, 2026
0
Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts

Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts

January 8, 2026
0
TSMC weighs further Arizona expansion with fabs and advanced packaging

TSMC weighs further Arizona expansion with fabs and advanced packaging

January 8, 2026
0
Marvell to buy XConn in $540 mln deal to strengthen AI data centre networking

Marvell to buy XConn in $540 mln deal to strengthen AI data centre networking

January 8, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator