December 22, 2025 /SemiMedia/ — Global semiconductor manufacturing is undergoing a structural shift as geopolitical risks and supply chain resilience drive governments to localize production, accelerating a redistribution of both advanced and mature chipmaking capacity.

U.S. accelerates advanced process capacity expansion

The United States is emerging as one of the fastest-growing regions for advanced process manufacturing. According to industry estimates from TrendForce, U.S. advanced-node capacity is expected to account for about 28% of global output by 2030, supported by heavy investment, government incentives and new fabs under construction.

Semiconductors are increasingly treated as strategic assets. Washington has prioritized domestic manufacturing, while China continues to pursue technology self-sufficiency. Japan, the European Union and India have also stepped up efforts to expand local chip production. Taiwan region, anchored by TSMC’s advanced manufacturing base, remains the world’s most important hub for cutting-edge logic chips.

From a foundry capacity perspective, IDC forecasts Taiwan’s wafer foundry capacity to grow at a compound annual rate of about 2.8% between 2025 and 2029. Growth in the United States is expected to be significantly faster, with capacity expanding at a CAGR of 8.4%, driven by TSMC’s Arizona fabs and increased capital spending by Samsung Electronics and Intel.

Japan is projected to post even stronger growth, with a foundry capacity CAGR of around 10%, supported by TSMC’s Kumamoto expansion and incremental output from Rapidus. In Europe, foundry capacity is expected to grow at an annual rate of roughly 6.3% as multiple countries roll out semiconductor manufacturing incentives.

As U.S. advanced-node capacity expands, Taiwan’s share of global advanced process output is expected to decline to about 55% by 2030, though it will remain the largest single advanced manufacturing base worldwide, TrendForce said.