SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ARM to set up chip IP R&D center in Hong Kong focused on AI
  • 0

ARM to set up chip IP R&D center in Hong Kong focused on AI

SemiMediaEdit
December 17, 2025

December 17, 2025 /SemiMedia/ — Arm said it plans to launch its first chip IP research and development center in Hong Kong in 2026, marking an expansion of its engineering footprint as demand grows for AI-focused semiconductor architectures.

Hong Kong R&D expansion targets AI-focused chip architectures

The planned center will concentrate on advanced chip architecture design and artificial intelligence solutions, with additional exploration into Physical AI and robotics-related computing applications, the company said.

According to senior technical director Zou Wei, the Hong Kong facility is expected to grow to more than 100 staff within three years and will serve as a hub linking global technology resources with local innovation, supporting next-generation IP development.

NPU and robotics applications drive IP development strategy

Arm China is also accelerating collaboration with local universities and research institutes, targeting joint development in NPU IP design, intelligent computing architectures and robotics use cases, as part of efforts to improve computing efficiency and real-world deployment.

The company said it will support Hong Kong’s semiconductor and AI talent initiatives by assigning experienced engineers and managers to the city and offering industry-oriented internship programs in cooperation with academia and research organizations.

Related

AI architectures R&D AI chip IP development Arm AI ecosystem expansion Arm China NPU IP Arm Hong Kong R&D edge AI processor IP emerging robotics applications Hong Kong tech hub neural processing unit IP robotics semiconductor IP
Samsung plans to phase out SATA SSDs, tightening consumer NAND supply
Previous
ST has delivered 5 billion RF antenna chips to SpaceX
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Murata to raise EMI component prices on rising silver costs

Murata to raise EMI component prices on rising silver costs

March 20, 2026
0
Lattice to raise FPGA prices by 10% on rising backend costs

Lattice to raise FPGA prices by 10% on rising backend costs

March 20, 2026
0
Micron plans new Taiwan fab to boost DRAM and HBM supply

Micron plans new Taiwan fab to boost DRAM and HBM supply

March 19, 2026
0
STMicroelectronics expands robotics, retrains staff to sustain legacy fabs

STMicroelectronics expands robotics, retrains staff to sustain legacy fabs

March 19, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • Electronic components distributor
  • NXP

SemiMediaEdit

Administrator