November 07, 2025 /SemiMedia/ — Micron’s schedule for its next-generation HBM4 product has been pushed back, according to several brokerage reports. Analysts said validation issues on bandwidth and yield have forced the U.S. memory maker to rework its design, raising the possibility that meaningful HBM4 shipments may slip into 2027.

HBM4 is expected to be the main memory technology for GPUs entering volume production in 2026. Industry sources said that major GPU vendors, including Nvidia and AMD, are already fixing their supply chain positions for that generation. The delay suggests Micron could lose share in the first wave of the transition.

Meanwhile, Korean suppliers are moving ahead. SK hynix has already completed its HBM4 production line and begun shipments, while Samsung is targeting mass production by late 2025 and is stressing yield improvement as a key differentiator.

Research firms expect HBM to take a larger share of the DRAM market in 2026, with HBM4 pricing remaining above HBM3E. The ability to deliver qualified volume will determine who captures the profit pool in the next AI server cycle.

Micron said it continues to introduce new processes and expects to ramp in 2026. But analysts noted the company must improve performance, yield and timing simultaneously, which will be a significant challenge.