SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › GF and Silicon Labs expand US-based output to support low-power wireless SoCs
  • 0

GF and Silicon Labs expand US-based output to support low-power wireless SoCs

SemiMediaEdit
November 5, 2025

November 05, 2025 /SemiMedia/ — GlobalFoundries and Silicon Labs said they expanded their partnership to bring next-generation low-power wireless SoCs into volume manufacturing in Malta, New York – the first introduction of this process technology at a US fab.

Silicon Labs CEO Matt Johnson said the deal reflects a shared push to strengthen US wireless innovation and manufacturing leadership, citing strong demand for the company’s Series 2 products and the need to deliver secure, scalable connectivity.

The SoCs will be built on GF’s new 40nm Ultra Low Power platform, which adds embedded SuperFlash on top of a proven 40nm node to combine low standby leakage, endurance and integrated analog for battery-powered edge devices requiring always-on functionality and data security.

GF CEO Tim Breen called the agreement a significant milestone in the companies’ relationship, adding that bringing this differentiated low-power technology to the New York fab underscores GF’s commitment to secure, onshore semiconductor production.

Development has started and volume is set to ramp over the next several years.

Related

40nm ULP Electornic parts supplier electronic components news Electronic components supplier GlobalFoundries IoT SoC Silicon Labs US semiconductor Wireless connectivity
DDR5 supply disruption intensifies as DRAM makers delay fourth-quarter contract pricing
Previous
EU and China make progress on Nexperia export talks as auto chip supply remains tight
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead

Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead

November 5, 2025
0
EU and China make progress on Nexperia export talks as auto chip supply remains tight

EU and China make progress on Nexperia export talks as auto chip supply remains tight

November 5, 2025
0
DDR5 supply disruption intensifies as DRAM makers delay fourth-quarter contract pricing

DDR5 supply disruption intensifies as DRAM makers delay fourth-quarter contract pricing

November 4, 2025
0
SK Hynix reviews a potential sale of Solidigm business

SK Hynix reviews a potential sale of Solidigm business

November 4, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator