SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › LA Semiconductor to sell Idaho wafer fab in Pocatello
  • 0

LA Semiconductor to sell Idaho wafer fab in Pocatello

SemiMediaEdit
September 25, 2025


September 25, 2025 /SemiMedia/ — LA Semiconductor has launched the sale of its wafer manufacturing plant in Pocatello, Idaho, with Macquarie Group appointed to oversee the process.

The 31-acre facility includes more than 57,000 square feet of cleanroom space, expandable for future needs. It currently manufactures processes ranging from 0.18µm to 1.5µm, covering BCD, CMOS, bipolar, MEMS, and discrete devices, with lithography capability down to 0.13µm. The site also houses a prototype assembly lab and 7,000 square feet dedicated to probe and test operations.

Acquired from onsemi in 2022, the fab has undergone process upgrades and IP development. Co-general manager Tony Little said the site is operating at its “most stable and efficient” level since the acquisition.

Executives noted that buyers increasingly prefer brownfield fabs that can enter production more quickly than greenfield projects. Co-general manager Pat Sedlmayer said the planned divestment aligns with the company’s strategy to streamline operations and sharpen its focus as an ITAR-registered onshore foundry.

Despite the planned sale, LA Semiconductor will continue to operate and provide custom semiconductor solutions for automotive, defense, aerospace, medical, industrial, and commercial sectors.

Related

analog chip production custom semiconductors electronic components news Electronic components supplier Electronic parts supplier fab sale MEMS manufacturing onshore semiconductor semiconductor foundry wafer fabrication plant
Microchip launches scalable gigabit Ethernet switches for industrial networks
Previous
Micron to begin HBM4 mass production in first half of 2026
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Allegro to raise prices by at least 10% from late April

Allegro to raise prices by at least 10% from late April

March 27, 2026
0
Infineon rolls out XDPP1188-200C for AI server 800V power designs

Infineon rolls out XDPP1188-200C for AI server 800V power designs

March 27, 2026
0
Broadcom warns of supply limits as foundry capacity tightens

Broadcom warns of supply limits as foundry capacity tightens

March 26, 2026
0
Asus sees PC prices rising 25%–30% as chip costs increase

Asus sees PC prices rising 25%–30% as chip costs increase

March 26, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • Electronic components distributor
  • NXP

SemiMediaEdit

Administrator