SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Renesas launches RA0L1 MCUs with ultra-low power and capacitive touch features
  • 0

Renesas launches RA0L1 MCUs with ultra-low power and capacitive touch features

SemiMediaEdit
September 18, 2025

September 18, 2025 /SemiMedia/ — Renesas Electronics has introduced the RA0L1 microcontroller group, built on the Arm Cortex-M23 core, targeting battery-powered devices, consumer appliances, and industrial controls with low-power and capacitive touch requirements.

The RA0L1 MCUs achieve just 2.9mA in active mode, 0.92mA in sleep mode, and as low as 0.25µA in software standby. An integrated high-speed on-chip oscillator enables rapid wake-up, allowing the devices to cut power consumption by up to 90% compared with conventional solutions.

Designed for cost-sensitive applications, the RA0L1 family supports an operating voltage range of 1.6V to 5.5V, reducing the need for external regulators. It integrates multiple communications interfaces, analog functions, and security features. Packaging options include QFN, LQFP, and LSSOP, with the smallest package measuring 4mm x 4mm.

The devices also bring Renesas’ capacitive touch technology, supporting up to 24 channels with self-capacitance for simplified waterproof design. The solution meets IEC61000 4-3 Level 4 standards, making it suitable for medical and industrial systems requiring high electromagnetic immunity.

RA0L1 MCUs are supported by Renesas’ Flexible Software Package (FSP), providing middleware, connectivity, and security stacks. This enables developers to build applications such as AI, motor control, and cloud connectivity with faster time to market.

The new RA0L1 devices, along with prototyping boards and development kits, are available now through Renesas and its distribution partners. For more information, please visit RA0L1 Group MCUs.

Related

capacitive touch MCU consumer electronics MCU Electronic components supplier embedded processing Industrial automation chips low power MCU microcontroller development RA0L1 MCU Renesas microcontroller semiconductor solutions
STMicroelectronics to invest $60 million in France for panel-level packaging pilot line
Previous
Edge Foundry expands infrared sensor business to strengthen Korea’s semiconductor sector
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Allegro rolls out low-loss isolated current sensor for high-power systems

Allegro rolls out low-loss isolated current sensor for high-power systems

January 30, 2026
0
Microchip expands maXTouch M1 controllers for automotive displays up to 42 inches

Microchip expands maXTouch M1 controllers for automotive displays up to 42 inches

January 29, 2026
0
NXP launches UCODE X chip to support smaller RAIN RFID labels

NXP launches UCODE X chip to support smaller RAIN RFID labels

January 28, 2026
0
ROHM launches 500mA LDO regulators aimed at compact power designs

ROHM launches 500mA LDO regulators aimed at compact power designs

January 27, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator