SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon rolls out new VR chips for AI servers to boost power design
  • 0

Infineon rolls out new VR chips for AI servers to boost power design

SemiMediaEdit
March 18, 2026

March 18, 2026 /SemiMedia/ — Infineon Technologies expanded its power chip lineup for AI data centers with new voltage regulation products, aiming to support rising demand from high-performance computing systems.

The company introduced XDPE1E digital multiphase buck controllers and TDA49720/12/06 point-of-load regulators, targeting both core and non-core power rails in AI servers.

As AI platforms scale, processors require higher current and faster response from core power rails, while more secondary rails need compact and efficient regulation. Infineon said its latest products are designed to address both needs and help simplify board-level power design.

The XDPE1E controllers support flexible phase setup and multiple industry interfaces, allowing reuse of power designs across different processor platforms. Built-in features help handle fast load changes and reduce tuning time during development.

For non-core rails, the TDA49720 series integrates power stages and supports PMBus-based monitoring. The devices provide real-time data such as voltage, current and temperature, helping improve system control and reliability.

The new products are part of Infineon’s broader AI server power portfolio, covering stages from high-voltage conversion to on-board DC-DC regulation, using silicon, SiC and GaN technologies.

For more information, please visit:

  • XDPE1E3G6At, XDPE1E496A PWM buck controllers 
  • TDA49720/12/06 integrated PoL voltage regulator 

Related

AI server power data center power Electronic components distributor electronic components news Infineon VR multiphase buck PMBus PoL
SK Hynix sees memory shortage extending to 2030 on AI demand
Previous

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

SK Hynix sees memory shortage extending to 2030 on AI demand

SK Hynix sees memory shortage extending to 2030 on AI demand

March 18, 2026
0
Chip material prices surge as supply risks hit compound semiconductors

Chip material prices surge as supply risks hit compound semiconductors

March 18, 2026
0
onsemi to raise prices on select products from April 1

onsemi to raise prices on select products from April 1

March 17, 2026
0
Samsung union strike vote raises risk to chip output in May

Samsung union strike vote raises risk to chip output in May

March 17, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • Electronic components distributor

SemiMediaEdit

Administrator