SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › GlobalFoundries 40nm platform powers Silicon Labs Wi-Fi 6 chip production
  • 0

GlobalFoundries 40nm platform powers Silicon Labs Wi-Fi 6 chip production

SemiMediaEdit
September 3, 2025

September 3, 2025 /SemiMedia/ — GlobalFoundries (GF) said its 40nm process technology has enabled the mass production of more than 10 million Wi-Fi chips for Silicon Labs, including the company’s new SiWX917 Wi-Fi 6 solution, underscoring the foundry’s role in powering the next wave of connected devices.

The milestone highlights GF’s 40LP platform, which delivers low leakage and stable performance for always-on intelligent devices. The process is widely adopted in sensing and monitoring applications, supporting power efficiency and accurate data capture.

Silicon Labs’ SiWX917 chip addresses one of the core challenges for battery-powered IoT devices by extending battery life without sacrificing secure and persistent connectivity. Built on GF’s manufacturing expertise, the chip brings reliable Wi-Fi 6 connectivity to a broad range of IoT products.

“Our differentiated technologies allow innovators to meet the growing demand for high-performance, cost-effective IoT solutions,” said Kamal Khouri, senior vice president of GF’s CMOS product line.

Silicon Labs vice president Irvind Ghai said the collaboration eliminates the trade-off between robust connectivity and long battery life. “Together with GF, we are scaling secure Wi-Fi solutions that enhance user experience while speeding up time to market,” he added.

Related

CMOS technology electronic components news Electronic components supplier Electronic parts supplier GlobalFoundries IoT devices Semiconductor manufacturing Silicon Labs Wi-Fi 6 chip
Infineon launches 150V OptiMOS 6 MOSFET family for electric vehicle power systems
Previous
Vishay launches automotive-grade DC-Link capacitor for high-temperature applications
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung targets May samples for HBM4E, eyes Nvidia AI demand

Samsung targets May samples for HBM4E, eyes Nvidia AI demand

April 21, 2026
0
Japan quake may disrupt semiconductor supply chain, hit NAND and photoresist output

Japan quake may disrupt semiconductor supply chain, hit NAND and photoresist output

April 21, 2026
0
Shin-Etsu to raise silicone prices as costs pressure semiconductor materials

Shin-Etsu to raise silicone prices as costs pressure semiconductor materials

April 21, 2026
0
UMC plans wafer price hikes in second half as demand stays firm

UMC plans wafer price hikes in second half as demand stays firm

April 20, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator