April 23, 2026 /SemiMedia/ — SK hynix has begun construction of a new semiconductor packaging and test plant in Cheongju, South Korea, as it moves to expand capacity for high bandwidth memory (HBM) used in artificial intelligence systems.

The project, known as P&T7, is scheduled for completion by the end of 2027. It will focus on packaging and testing for advanced memory products, including HBM3E and next-generation HBM4.

Demand for AI chips has pushed HBM supply tight, especially at the packaging stage. SK hynix said the new site will use technologies such as 3D stacking and fan-out packaging to improve output and efficiency. The plant will also work closely with its M15X wafer fab in Cheongju to shorten production cycles and improve yields.

The company plans to bring capacity online in stages. Wafer test lines are expected to be completed first, followed by wafer-level packaging lines, allowing output to increase step by step as demand grows.

SK hynix is also expanding its packaging footprint outside Korea. In the United States, the company has started early construction work on a packaging facility in Indiana, with a target to begin operations in the second half of 2028.

With new sites in Cheongju and the U.S., along with its existing base in Icheon, SK hynix is building a broader packaging network to support global AI infrastructure demand.