June 17, 2025 /SemiMedia/ — Micron Technology is expected to significantly increase its domestic DRAM production, with its U.S.-based output projected to account for around 40% of its total capacity, according to the latest market research from DIGITIMES.

The surge in AI-related demand has intensified the global competition among the top three memory chipmakers, especially in advanced memory types such as HBM and new-generation modules. The introduction of the HBM4 standard by JEDEC signals the beginning of a new phase in high-bandwidth memory, requiring tighter integration with logic chips and deeper collaboration between memory suppliers and leading foundries.

Beyond technical evolution, geopolitical dynamics are increasingly shaping strategic decisions in the memory industry. Micron's expansion of U.S. manufacturing aligns with Washington's localization push, aimed at securing domestic semiconductor supply chains. DIGITIMES notes that memory chips, particularly DRAM and HBM, are becoming critical enablers of AI infrastructure and are now viewed as strategic assets in national policy.

With HBM technologies becoming more interdependent with logic processing and packaging innovations, the role of memory makers in the semiconductor ecosystem continues to evolve, with geopolitical strategy now playing a key role in capacity planning.