SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Renesas launches RA2L2 MCU with USB‑C 2.4 support and ultra‑low power
  • 0

Renesas launches RA2L2 MCU with USB‑C 2.4 support and ultra‑low power

SemiMediaEdit
June 10, 2025

June 10, 2025 /SemiMedia/ — Renesas Electronics Corp. has introduced its RA2L2 microcontroller family, featuring ultra‑low power consumption and industry‑first compliance with USB‑C Revision 2.4 – a notable step forward for semiconductor-based peripheral solutions.

Built around a 48 MHz Arm Cortex‑M23 core, the RA2L2 MCUs support the new USB‑C spec’s lower voltage detection thresholds (0.613 V at 1.5 A, 1.165 V at 3 A), enabling precise connector handling in semiconductor peripherals. With active-mode current at just 87.5 µA/MHz and software-standby as low as 250 nA, plus a dedicated low-power UART clock for waking via Wi‑Fi or Bluetooth LE, the RA2L2 targets battery‑powered semiconductor devices such as data loggers, charge cases and barcode readers.

In addition to full-speed USB‑C CC detection up to 5 V/3 A (15 W) and USB‑FS support, the MCU integrates I³C, CAN, LP‑UART, SPI, I²S and a 12‑bit ADC with 17 channels. This rich peripheral set helps reduce component count, board footprint, and system costs in semiconductor-based designs.

The RA2L2 family is supported by Renesas’ Flexible Software Package (FSP), which provides infrastructure for RTOS, BSP, peripheral drivers, middleware, connectivity and cloud, plus reference code for AI, motor control and cloud implementations. FSP enables easy migration of legacy RA‑series IP and supports customers’ preferred real-time OS.

“Our RA2L2 MCUs are the first in our lineup to offer full-speed USB with USB‑C connector support, while maintaining the low‑power and cost benefits of the RA2L1 series,” said Daryl Khoo, VP of Embedded Processing Marketing at Renesas. “These devices reflect our commitment to rapidly delivering semiconductor solutions tailored to customer needs.”

The RA2L2 MCU series is now available, along with evaluation kits and FSP software.For more information, please visit RA2L2 MCUs.

Related

STMicroelectronics and Qualcomm Launch Mass Production of ST67W611M1 Wi-Fi 6/Bluetooth 5.4 Module for STM32 Ecosystem
Previous
GlobalFoundries to invest €1.1 billion to double Dresden fab capacity
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Taiyo Yuden announces new part number system for passive components

Taiyo Yuden announces new part number system for passive components

February 6, 2026
0
Allegro rolls out low-loss isolated current sensor for high-power systems

Allegro rolls out low-loss isolated current sensor for high-power systems

January 30, 2026
0
Microchip expands maXTouch M1 controllers for automotive displays up to 42 inches

Microchip expands maXTouch M1 controllers for automotive displays up to 42 inches

January 29, 2026
0
NXP launches UCODE X chip to support smaller RAIN RFID labels

NXP launches UCODE X chip to support smaller RAIN RFID labels

January 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator