April 13, 2025 /Semi/ — TSMC's planned U.S. fabs in Arizona have seen their future production capacity—especially for 2nm and below nodes—fully booked by major American clients, underscoring rising demand for geopolitically secure semiconductor manufacturing.

Amid Washington’s continued push to localize chip production, companies like Apple, Nvidia, AMD, Qualcomm, and Broadcom are securing long-term capacity at TSMC’s U.S. sites. Sources say all capacity from three additional fabs under consideration has already been reserved in advance.

Initial yield results from TSMC’s Arizona fabs have reportedly met expectations, prompting increased customer engagement. In response, the third plant broke ground earlier than planned, while expansion efforts for three more fabs are accelerating.

TSMC’s global expansion strategy is expected to significantly shift its manufacturing footprint. Analysts project overseas capacity—mainly from Japan, the U.S., and Germany—will make up around 20% of TSMC’s total output by 2028, with potential for further growth depending on foreign subsidies and regional demand.

For nodes at 2nm and beyond, production is expected to be distributed 70% in Taiwan and 30% in the U.S. by 2030, providing supply chain diversification for strategic customers.

In March, TSMC announced a substantial increase in its U.S. investment to $165 billion. The initiative includes six fabs, two advanced packaging facilities, and a major R&D center. Chairman and CEO C.C. Wei confirmed that approximately 30% of TSMC’s sub-2nm capacity will be based in the U.S., aligning with the needs of its largest clients.