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Samsung to end DDR4 production, shifts focus to DDR5 and HBM

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April 23, 2025

April 23, 2025 /SemiMedia/ — Samsung Electronics is set to phase out production of its 8Gb LPDDR4 memory built on the 1z node, with final orders accepted until June 2025 and last shipments expected by October, according to industry sources.

While the company declined to comment on customer-specific programs, it confirmed that internal development is proceeding as planned.

The move is seen as part of Samsung’s broader strategy to allocate resources to higher-margin products such as DDR5 and high-bandwidth memory (HBM), amid weakening demand and increasing competition in legacy memory segments.

Industry analysts attribute the decision partly to Chinese memory suppliers gaining share in the low-end mobile segment, as well as intensifying price pressure in the DDR4 market. With mainland Chinese vendors expanding DDR4 capacity, profitability has become a growing concern for global memory manufacturers.

Winbond and Nanya Technology, which continue to prioritize DDR4 production, may benefit from Samsung’s market exit, especially in industrial and PC-related applications.

Market research firms have revised 2025 global bit growth forecasts for DRAM downward, from 12.8% to 4.8%, with bearish scenarios suggesting a possible low of 3.5%, highlighting a challenging environment for traditional memory products.

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Chinese memory suppliers DDR4 EOL DDR5 migration DRAM market outlook electronic components news Electronic components supplier Electronic parts supplier HBM memory legacy memory exit LPDDR4 phase-out memory chip strategy SAMSUNG semiconductor memory trends
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