February 10, 2025 /SemiMedia/ — NXP Semiconductors Romania SRL is enhancing its European research and development (R&D) efforts through subsidies from the 2nd Important Project of Common European Interest on Microelectronics and Communication Technologies (IPCEI ME/CT). The funding, expected to reach a double-digit million-euro range, supports the "SENTHICOM" project. NXP teams in Bucharest and Sibiu will focus on hardware-software co-design and embedded software development for advanced automotive and communication technologies, aligning with IPCEI ME/CT initiatives in Germany and the Netherlands. Development began in April 2023 and is set to conclude by 2028.

By advancing software R&D in Romania, NXP strengthens Europe's technological resilience and supports the EU’s digital and green transition. The company collaborates with Romanian academic institutions and industry leaders such as Bosch Romania and Continental Romania to drive innovation. Engaging with top universities on over 30 research topics, NXP is contributing to Romania’s national goal of building a robust microelectronics and communication technology ecosystem across seven cities.

Simona Almăjan, Country Manager of NXP Romania, emphasized the significance of regional collaboration: "We appreciate the efforts of the EU Commission, Romania’s Ministry of Investment and European Projects (MIPE), the Ministry of Economy, Entrepreneurship and Tourism (MEAT), and the Romanian Academy in advancing the European microelectronics industry. Strengthening Romania’s local ecosystem is a priority for NXP, as demonstrated by the recent opening of our second R&D center in Sibiu and our expansion plans in Bucharest and Sibiu."

NXP Romania’s R&D activities span multiple IPCEI workstreams. Under the "Think" workstream, efforts focus on hardware-software co-design for high-performance automotive-grade microprocessors and software-defined vehicle architectures. This includes the development of a next-generation super-integration processor and an automotive-grade software development kit featuring firmware, runtime software, and development tools with demo applications.

Within the "Sense" workstream, NXP Romania and its partners are advancing next-generation automotive radar systems. Their research covers radar transceiver development, radar signal processing, AI-driven radar applications, and platform enablement software.

Beyond Romania, NXP is also investing in Austria, Germany, and the Netherlands through IPCEI ME/CT subsidies. These efforts align with the broader European semiconductor strategy, following the establishment of the European Semiconductor Manufacturing Company (ESMC)—a joint venture between NXP, TSMC, Bosch, and Infineon. ESMC’s new 300mm fab in Dresden, Germany, set to feature advanced FinFET technology, is expected to reinforce Europe’s semiconductor manufacturing capabilities and generate approximately 2,000 high-tech jobs.