SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › US allocates $1.4 billion to boost semiconductor advanced packaging industry
  • 0

US allocates $1.4 billion to boost semiconductor advanced packaging industry

SemiMediaEdit
January 20, 2025

January 20, 2025 /SemiMedia/ — The U.S. Department of Commerce has announced a $1.4 billion allocation to three projects and the National Advanced Packaging Manufacturing Program (NAPMP). The funding aims to establish a self-sufficient, large-scale domestic semiconductor advanced packaging industry to manufacture and package advanced node chips in the U.S.

Absolics, Applied Materials, and Arizona State University will receive a total of $300 million for substrate research projects. Additionally, $1.1 billion will go toward prototype design and the NAPMP advanced packaging pilot facility (PPF) to enhance advanced packaging capabilities.

"Strengthening advanced packaging capabilities is critical to ensuring the United States remains a global leader in cutting-edge semiconductor manufacturing," said U.S. Commerce Secretary Gina Raimondo. "These investments and flagship research facilities will reinforce our end-to-end semiconductor ecosystem, close the gap between innovation and commercialization, and secure U.S. leadership in semiconductor innovation and manufacturing."

Project Details:

  • Absolics (Covington, Georgia) will receive $100 million for glass substrate technology research, an increase from its initial subsidy of $75 million. This is part of the SMART (Substrate and Materials Advanced Research and Technology) initiative.
  • Applied Materials (Santa Clara, California) will also receive $100 million to develop silicon-based substrate technology for next-generation semiconductor advanced packaging and 3D heterogeneous integration.
  • Arizona State University will receive $100 million to develop next-generation semiconductor microelectronics packaging using fan-out wafer-level packaging (FOWLP) technology. The project will explore the commercialization of 300mm wafer-level and 600mm panel-level manufacturing, which is currently unavailable in the U.S.

Additionally, the Natcast Semiconductor Advanced Packaging Facility (Tempe, Arizona) will receive $1.1 billion to build a baseline pilot production line for advanced packaging technologies. This facility will enable researchers and industry leaders to test new materials and equipment, further strengthening the U.S. semiconductor sector.

Related

electronic components news Electronic components supplier Electronic parts supplier US advanced packaging
Microchip introduces new Switchtec™ PCIe® Gen 4.0 16-lane switch family for automotive and embedded computing applications
Previous
Japan to invest $1 billion to boost chip design industry
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Littelfuse unveils foldback TVS diode series for advanced DC power protection

Littelfuse unveils foldback TVS diode series for advanced DC power protection

July 30, 2025
0
Electronic component prices climb as industrial and EV markets revive

Electronic component prices climb as industrial and EV markets revive

July 30, 2025
0
Global foundry revenue to surpass $165 billion in 2025 driven by advanced nodes

Global foundry revenue to surpass $165 billion in 2025 driven by advanced nodes

July 29, 2025
0
onsemi expands SiC partnership with Schaeffler for next-gen PHEV platform

onsemi expands SiC partnership with Schaeffler for next-gen PHEV platform

July 29, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator