October 25, 2024 /SemiMedia/ — SEMI, in its annual silicon wafer shipment forecast, reported that global silicon wafer shipments are expected to decline by 2% in 2024, reaching 12.174 billion square inches (MSI). However, demand recovery is projected to drive a strong rebound of 10% in 2025, with shipments rising to 13.328 billion square inches (MSI).
The anticipated recovery in silicon wafer shipments is largely driven by increasing demand for artificial intelligence (AI) and advanced manufacturing technologies. As these technologies see broader adoption, wafer fab utilization rates across global semiconductor capacity continue to improve. Additionally, new applications in advanced packaging and high-bandwidth memory (HBM) are contributing to the increased demand for silicon wafers. These applications include temporary or permanent carrier wafers, interposers, chiplet separation, and separating memory and logic arrays.
Looking ahead, SEMI expects strong growth in silicon wafer shipments to continue through 2027, driven by ongoing advancements in these technologies. This growth underscores the critical role of silicon wafers as a foundational material, reflecting the market's heavy reliance on semiconductor components.
SEMI noted that the data in the report includes polished and epitaxial silicon wafers delivered by wafer manufacturers to end users, excluding unpolished or reclaimed wafers.
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