October 28, 2024 /SemiMedia/ — Today, Intel announced the expansion of its packaging and testing facility in Chengdu. The expansion will introduce services for server chip packaging and testing, building on its existing capabilities for client products. Additionally, Intel will establish a customer solutions center to enhance local supply chain efficiency, strengthen support for Chinese customers, and improve response times.

The expansion plan focuses on increasing capacity for server chip packaging and testing, addressing the growing demand from Chinese customers for high-efficiency, customized packaging solutions. The upcoming Intel Customer Solutions Center aims to serve as a one-stop platform to drive digital transformation, offering industry customers tailored solutions based on Intel architecture and products to accelerate the deployment of industry applications.

Wang Rui, Intel Senior Vice President and Chair of Intel China, stated that the Chengdu facility expansion will allow Intel to better address local needs, integrate resources, and respond more quickly to China's digital and green transitions, injecting new momentum into the sustainable digital economy.