October 15, 2024 /SemiMedia/ — According to the Global Semiconductor Packaging Materials Outlook (GSPMO) report by SEMI, TECHCET, and TechSearch International, the global semiconductor packaging materials market is set for a growth cycle, with a projected compound annual growth rate (CAGR) of 5.6% through 2028. Strong demand from various end-use applications is driving this expansion.
The report highlights artificial intelligence as a key driver for advanced packaging applications, despite the current lower production volumes in this emerging segment.
TECHCET President and CEO Lita Shon-Roy noted that the semiconductor packaging materials market faced a 15.5% decline in 2023. However, growth is expected to resume in 2024, with the market size surpassing $26 billion by 2025 and continuing to grow steadily through 2028.
TechSearch International President Jan Vardaman emphasized that substrates account for a significant portion of the market's revenue, with FC-BGA substrates being a major contributor. From 2023 to 2028, flip-chip BGA/LGA revenue is projected to see a 7.6% CAGR. Other growth areas include wafer-level packaging (WLP) dielectric materials and flip-chip underfills. Laminate substrates are expected to grow at 7.3% annually, while lead frames and bonding wires are also forecasted to recover, with growth rates of 5.0% and 6.4%, respectively.
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