SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Tata breaks ground on IC backend factory in India
  • 0

Tata breaks ground on IC backend factory in India

SemiMediaEdit
August 6, 2024

August 6, 2024 /SemiMedia/ -- According to reports, Tata Electronics has begun construction of its first integrated circuit (IC) back-end factory in Assam, eastern India, a milestone in India's efforts to build a local chip manufacturing ecosystem.

Tata Electronics held a groundbreaking ceremony at the site of the factory on August 3. The factory involves an investment of 270 billion Indian rupees (3.22 billion U.S. dollars) and is expected to create 15,000 direct jobs and 11,000 to 13,000 indirect jobs.

The plant is expected to be operational by 2025 and will cater to industries such as automotive and mobile devices. The factory will also focus on advanced semiconductor packaging technologies, including wire bonding, flip chip and integrated system-in-package (I-SIP) technologies developed in India.

“Given that we want to move fast, we are trying to expedite the construction of this plant. We hope to have some parts of the facility completed and operational quickly sometime in 2025,” said N Chandrasekaran, chairman of Tata.

Related

electronic components news Electronic components supplier Electronic parts supplier Tata Assam Tata IC Tata semiconductor
Infineon announces layoffs
Previous
Malaysia sets up chip design center
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

January 16, 2026
0
8-inch wafer foundry capacity tightens in 2026 as utilization rises

8-inch wafer foundry capacity tightens in 2026 as utilization rises

January 16, 2026
0
2025 semiconductor revenue reaches $793 billion as AI demand accelerates

2025 semiconductor revenue reaches $793 billion as AI demand accelerates

January 16, 2026
0
South Korea pushes SiC and GaN power chips in foundry drive

South Korea pushes SiC and GaN power chips in foundry drive

January 15, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator