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Home › MarketWatch › VISC and NXP's Singapore fab to break ground in second half of 2024
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VISC and NXP's Singapore fab to break ground in second half of 2024

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July 25, 2024

July 25, 2024 /SemiMedia/ -- According to reports, Vanguard International Semiconductor Corporation's (VISC) Singapore 12-inch wafer fab will begin construction in the second half of this year, is expected to start trial production in 2027, and start generating profits for the company in 2029.

The new wafer fab VSMC (VisionPower Semiconductor Manufacturing Company) established by VISC and NXP in Singapore will start construction in the second half of this year. The new fab's process node is 0.13um to 40nm, and its main applications are power management, analog, and mixed-signal products.

VISC previously expected that the new fab would begin moving in equipment around the end of 2026 and start small-scale production in 2027. It is estimated that the monthly production capacity will be about 10,000 pieces in 2027, 30,000 pieces in 2028, and the total production capacity will reach 55,000 pieces per month in 2029.

The report pointed out that the new fab will break even in 2028 and contribute approximately NT$15.8 billion to VISC's revenue in 2029, accounting for approximately 15% to 20% of the total revenue in 2029, with a gross profit margin of 28% to 30%.

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