SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel's new wafer fab construction in Magdeburg, Germany delayed
  • 0

Intel's new wafer fab construction in Magdeburg, Germany delayed

SemiMediaEdit
July 17, 2024

July 17, 2024 /SemiMedia/ -- According to reports, Intel's 30 billion euro Fab 29 project in Magdeburg, Germany, which was announced earlier, has been delayed in recent days due to multiple obstacles including subsidies and environmental protection. Despite this, the report said that Intel's foundation work has begun.

Intel's Magdeburg Fab 29.1 and Fab 29.2 are planned to cover an area of approximately 81,000 square meters, with a total length of 530 meters and a width of 153 meters. Including the roof structure for air conditioning and heating, the building height will reach 36.7 meters, in addition, there will be several underground floors.

The Fab 29 was originally scheduled to start construction in the first half of 2023, but the start time was postponed to the summer of 2024 due to delays in subsidy approval. Recently, it was reported that the construction time of the wafer factory was postponed again to May 2025 due to pending EU subsidy approval and the need to relocate the black soil to other locations for reuse.

The Fab 29 Modules 1 and 2 were originally scheduled to begin operations at the end of 2027 and produce Intel 14A (1.4nm-class) and Intel 10A (1nm-class) process node chips. However, some recent reports have shown a different timeline, estimating that the fab will take four to five years to build, and is now expected to start producing chips in 2029 to 2030.

Related

electronic components news Electronic components supplier Electronic parts supplier Intel Magdeburg
TDK introduces 400 to 750W rugged step-down DC-DC converters with conduction cooling and a wide range of input and output
Previous
Samsung suspends construction of foundry production line at Pyeongtaek P4 plant, report says
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Micron to build semiconductor SEZ in India under $1.6 billion investment plan

Micron to build semiconductor SEZ in India under $1.6 billion investment plan

June 12, 2025
0
Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

June 12, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator