SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ASE: Advanced packaging revenue is expected to increase by more than US$250 million in 2024
  • 0

ASE: Advanced packaging revenue is expected to increase by more than US$250 million in 2024

SemiMediaEdit
July 1, 2024

July 1, 2024 /SemiMedia/ -- Dr. Tien Wu, Chief Operating Officer (COO) of ASE, recently stated that demand for advanced packaging will continue to be strong until 2025, and this year's AI-related CoWoS advanced packaging revenue will increase by more than $250 million compared to original expectations.

Dr. Tien Wu said that ASE has been developing advanced packaging for many years and is a close partner with important customers. In addition, the cooperation effect between ASE and major customers in silicon photonics and co-packaged optical components is gradually showing.

Dr. Tien Wu pointed out that in order to cope with the needs and changes of the global semiconductor industry, ASE Group is currently actively developing overseas operations and does not rule out expanding advanced packaging production capacity and building advanced packaging plants in Japan, the United States, Mexico and other places.

Dr. Tien Wu also said that the global demand for AI is expected to remain strong in the second half of this year and next year, which will also drive the advanced packaging market. Therefore, ASE is currently evaluating its global layout in consideration of market and customer needs.

Related

Advanced packaging ASE electronic components news Electronic components supplier Electronic parts supplier
Vishay launches new 1200 V SiC schottky diode to improve efficiency and reliability in switching power designs
Previous
Samsung plans to produce 2nm chips at its Taylor fab in 2026
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

STMicroelectronics expands Metalenz licensing to scale metasurface optics production

STMicroelectronics expands Metalenz licensing to scale metasurface optics production

July 16, 2025
0
Semiconductor firms gain from U.S.–China policy shift on AI chips and rare earths

Semiconductor firms gain from U.S.–China policy shift on AI chips and rare earths

July 16, 2025
0
Vishay launches new Gen 3 SiC Schottky diodes for efficient high-voltage power systems

Vishay launches new Gen 3 SiC Schottky diodes for efficient high-voltage power systems

July 16, 2025
0
Texas Instruments recognized by Volkswagen for automotive semiconductor supply excellence

Texas Instruments recognized by Volkswagen for automotive semiconductor supply excellence

July 15, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator