July 1, 2024 /SemiMedia/ -- Dr. Tien Wu, Chief Operating Officer (COO) of ASE, recently stated that demand for advanced packaging will continue to be strong until 2025, and this year's AI-related CoWoS advanced packaging revenue will increase by more than $250 million compared to original expectations.

Dr. Tien Wu said that ASE has been developing advanced packaging for many years and is a close partner with important customers. In addition, the cooperation effect between ASE and major customers in silicon photonics and co-packaged optical components is gradually showing.

Dr. Tien Wu pointed out that in order to cope with the needs and changes of the global semiconductor industry, ASE Group is currently actively developing overseas operations and does not rule out expanding advanced packaging production capacity and building advanced packaging plants in Japan, the United States, Mexico and other places.

Dr. Tien Wu also said that the global demand for AI is expected to remain strong in the second half of this year and next year, which will also drive the advanced packaging market. Therefore, ASE is currently evaluating its global layout in consideration of market and customer needs.