SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon launches industry's first space-qualified radiation-tolerant memory portfolio
  • 0

Infineon launches industry's first space-qualified radiation-tolerant memory portfolio

SemiMediaEdit
June 21, 2024

June 21, 2024 /SemiMedia/ -- Infineon Technologies has introduced the industry's first radiation-hardened (rad hard) 1 and 2 Mb parallel interface ferroelectric RAM (F-RAM) non-volatile memory devices. These additions to Infineon’s extensive portfolio of memories feature unsurpassed reliability and endurance, with up to 120 years of data retention at 85-degree Celsius, along with random access and full memory write at bus speeds.

Infineon F-RAM devices are intrinsically rad hard, and the technology is ideally suited for the evolving mission requirements of space-based applications that historically have used slower, less rugged EEPROM nonvolatile storage devices. Features compared to alternatives include faster memory random access, better data security with instant non-volatile write technology and low power, with extremely low programming voltage down to 2 V and maximum operating current of 20 mA.

“As more space applications are architected to process data on-system, and not on-ground via telemetry, there is increasing demand for high-reliability non-volatile memory to work in tandem with space-grade processors and FPGAs for data-logging applications,” said Helmut Puchner, Vice President, Fellow Aerospace and Defense, Infineon Technologies. “Infineon introduced the first SPI F-RAM devices for this market in 2022, and the addition of parallel interface devices reflects our commitment to delivering best-in-class, highly reliable and flexible solutions for next-generation space requirements.”

Target applications for Infineon’s rad hard F-RAM devices include data storage for sensors and instruments, data logging for calibration data, secure key storage for data encryption, and boot code storage. In addition to outer space, they are also suitable for avionic and other applications that require military standard temperature grades (-55°C to 125°C).

Like the SPI version, the chemical composition of the new Infineon parallel interface F-RAM devices results in exceptional non-volatile memory features, including instantaneous switching of atomic state, instead of a trapped charge to program bits in EEPROM technologies. F-RAM is inherently immune to soft errors and magnetic field or radiation effects. There is no requirement for software to manage page boundaries, and near infinite endurance (10 13 write cycles) means there is no need for wear leveling. 

The complete portfolio of rad hard F-RAM non-volatile memories, including 2 Mb SPI and 1 and 2 Mb parallel devices, is available now. More information please visit www.infineon.com/1and2MbFRAM.

Related

electronic components news Electronic components supplier Electronic parts supplier Infineon
Wolfspeed delays construction of new chip fab in Germany
Previous
DB Hitek to produce chips for Tesla
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Global memory revenue set to jump in 2026 on AI demand for DRAM, NAND, TrendForce says

Global memory revenue set to jump in 2026 on AI demand for DRAM, NAND, TrendForce says

January 23, 2026
0
GlobalWafers plans phase-two expansion of Texas 12-inch silicon wafer fab

GlobalWafers plans phase-two expansion of Texas 12-inch silicon wafer fab

January 23, 2026
0
Infineon launches EZ-USB FX2G3 controller with high performance and security for USB devices

Infineon launches EZ-USB FX2G3 controller with high performance and security for USB devices

January 22, 2026
0
SK hynix completes Wuxi DRAM fab upgrade, enabling advanced 1a process production

SK hynix completes Wuxi DRAM fab upgrade, enabling advanced 1a process production

January 22, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator