SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Micron raises 2024 capex forecasts to increase investment in HBM
  • 0

Micron raises 2024 capex forecasts to increase investment in HBM

SemiMediaEdit
May 23, 2024

May 23, 2024 /SemiMedia/ -- According to reports, Micron Technology has raised its capital expenditure forecast for 2024 to increase investment in the production of high-bandwidth memory (HBM) semiconductors to meet the growing needs of the artificial intelligence (AI) industry.

Micron Chief Financial Officer Matt Murphy said recently that the company will raise its 2024 capital expenditure forecast to about $8 billion from the previous $7.5 billion.

Micron Technology is one of the three major suppliers of HBM chips, which are an important part of the hardware used in artificial intelligence servers. Micron's advanced HBM3E will be used in Nvidia's H200 chip.

Micron has previously stated that HBM chip production capacity has been sold out in 2024, and most of the available production capacity in 2025 has also been allocated. Micron currently offers 8-layer HBM and has begun providing 12-layer HBM samples.

"By fiscal 2025, we expect HBM to become a multi-billion dollar business." Micron COO Manish Bhatia said.

Related

electronic components news Electronic components supplier Electronic parts supplier Micron HBM
Melexis launches MLX90427 position sensing for steer-by-wire
Previous
Allegro releases new isolated gate driver products
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

Marvell teams up with Rebellions to deliver custom AI infrastructure for sovereign markets

July 31, 2025
0
Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.

July 31, 2025
0
Renesas launches RZ/G3E MPU with AI acceleration and edge computing for industrial HMI applications

Renesas launches RZ/G3E MPU with AI acceleration and edge computing for industrial HMI applications

July 31, 2025
0
Littelfuse unveils foldback TVS diode series for advanced DC power protection

Littelfuse unveils foldback TVS diode series for advanced DC power protection

July 30, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator