SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TI lays off power chip R&D team in Beijing
  • 0

TI lays off power chip R&D team in Beijing

SemiMediaEdit
February 29, 2024

February 29, 2024 /SemiMedia/ -- According to supply chain insiders, Texas Instruments recently laid off one of its chip design teams in Beijing, which was mainly responsible for the research and development of low-end power chips.

The insider said that TI's layoffs were affected by the sluggish demand in the entire consumer market. On the other hand, competition from Chinese power chip manufacturers also forced TI to make this decision.

The insider also said that the current tense relations between China and the United States may also be one of the reasons driving TI's layoffs.

TI stated in its financial report last month that the company's industrial sector is increasingly weak, and the automotive industry has continued to decline. Various industries have experienced declines at different times.

Related

electronic components news Electronic components supplier Electronic parts supplier Texas Instruments
Vishay launches IGBT power modules in redesigned INT-A-PAK package that reduces conduction and switching losses
Previous
Murata announces absorption-type merger
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Rohm and Toshiba discuss combining power semiconductor operations

Rohm and Toshiba discuss combining power semiconductor operations

March 13, 2026
0
Top foundries post $46.3 bln revenue in Q4 2025 as TSMC keeps strong lead

Top foundries post $46.3 bln revenue in Q4 2025 as TSMC keeps strong lead

March 13, 2026
0
Microchip launches LX4580 mixed-signal IC for aerospace and defense systems

Microchip launches LX4580 mixed-signal IC for aerospace and defense systems

March 13, 2026
0
Infineon expands MCU market lead to 23.2% share in 2025

Infineon expands MCU market lead to 23.2% share in 2025

March 12, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator