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TI to build a new 300mm fab in Utah
Nikkei: TI plans to expand production capacity at Japan's Fukushima fab
TI: Weakness in all markets except automotive
TDK with TI on the world’s first sensor module with built-in edge AI and wireless mesh connectivity
TrendForce: Global production capacity of PMICs is expected to up 4.7%
TI announces partnership with Chicony Power to bring GaN technology to next-generation energy-efficient laptop power adapters
TI announces expansion of space-grade portfolio with radiation-hardened and radiation-tolerant plastic packages for missions from new space to deep space
APIs - A big step forward of TI store
TI: Weak demand spreads to industrial chips
TI announces initial production at new 300mm fab in Richardson, Texas
Insiders: IDMs are fighting for more foundry orders
Texas Instruments announces new Bluetooth wireless MCUs, making high-quality RF and power performance more affordable
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