SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK released SmartedGeml™ to run ultra-low power machine learning models on a 6-axis IMU
  • 0

TDK released SmartedGeml™ to run ultra-low power machine learning models on a 6-axis IMU

SemiMediaEdit
January 15, 2024

January 15, 2024 /SemiMedia/ -- TDK Corporation has launched the InvenSense SmartEdgeMLTM, an advanced edge ML solution enabling new possibilities for wearables, hearables, AR glasses, IoT, and other products that benefit from machine learning (ML) at the sensor chip level. SmartEdgeML is the first solution to generate and run machine learning models on a 2.5 x 3mm 6-axis motion sensor IMU at < 30 µA.

“TDK’s SmartEdgeML is a paradigm shift in edge machine learning, as it will allow developers, ODMs, and OEMs to implement ML-optimized motion sensor algorithms on an IMU sensor chip. This reduces the amount of raw data going to edge processors, which significantly improves device battery life, data privacy, and system latency,” said Sahil Choudhary, Director Motion Sensors and Software at InvenSense, a TDK Group company.

TDK also announces the availability of the InvenSense SmartBug 2.0 (MD-45686-ML), a multi-sensor wireless module consisting of the InvenSense ICM-45686-S IMU. This module works as the perfect evaluation system for users to get started with the InvenSense SIF and the ICM-45686-S IMU. The SIF is now available for download, while the MD-45686-ML and ICM-45686-S will be available at distributors by February 1, 2024.

There are three components of SmartEdgeML, which include:

  • SIF (sensor inference framework): SIF, the software component of SmartEdgeML, is a complete machine learning framework by TDK, providing a one-stop-shop for users to collect IMU sensor data, select custom features, build ML models, test ML performance, deploy, and run those models on the ICM-45686-S IMU through the SmartBug 2.0. Tested examples include algorithms such as exercise classification (squats, jumping jacks, lateral raises, or push-ups) and wrist gesture classification (fight, turn, shake, or still).
  • ICM-45686-S IMU: This is the hardware component of SmartEdgeML. The SmartMotion ICM-45686-S is a 2.5 x 3mm IMU from the TDK BalancedGyro™ family that enables ML decision tree models to be run on-chip at the lowest current consumption (< 30 µA). This new IMU provides premium temperature stability and vibration rejection, making it optimal for applications such as AR glasses, VR, OIS, drones, TWS, and robotics that need a combination of high-performance and ultra-low power machine learning algorithms.
  • SmartBug 2.0 (ML version): MD-45686-ML is an all-in-one multi-sensor wireless module that comes with the ICM-45686-S 6-axis motion sensor and is compatible with the SIF. The small form factor and BLE + USB interface of SmartBug 2.0 allows users to get started quickly with SIF so they can move easily from data collection to building ML models, to deploying on the ICM-45686-S IMU. This is the go-to device for getting started with SmartEdgeML.

For more information about SmartEdgeML, please visit invensense.tdk.com/smartedgeml.

Related

electronic components news Electronic components supplier Electronic parts supplier SmartedGeml TDK
Microchip plans to suspend production for 2 weeks at the Gresham factory
Previous
ST launches new LoRaWAN sub-1GHz STM32 SiP module to simplify long-range IoT connectivity
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron to phase out DDR4 as DRAM prices spike amid supply shift

Micron to phase out DDR4 as DRAM prices spike amid supply shift

June 16, 2025
0
Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator