SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › STMicroelectronics’ NFC technology is powering the Alcatel smartphone for European market
  • 0

STMicroelectronics’ NFC technology is powering the Alcatel smartphone for European market

SemiMediaEdit
June 11, 2018

STMicroelectronics recently revealed that its Near Field Communication (NFC) technology is supporting TCL Communication’s new contactless capabilities for Alcatel 3V smartphones for the European market. Through Alcatel's 3V NFC function, which enhances the user experience and convenience. TCL Communication chose ST's NFC controller chip as its unique technology to improve RF performance without depleting battery life.

ST's technology ensures fast and reliable contactless payments, electronic ticket transactions, and strong connectivity for point-to-point data transmission with the chip ST21NFCD. Excellent RF performance also helps TCL Communication simplify authentication to mandatory strict EMVCo, GSMA and NFC Forum mobile phone standards.

STMicroelectronics’ NFC technology is powering the Alcatel smartphone for European market-SemiMedia

“We are pleased to work with ST to provide reliable and secure contactless connectivity for Alcatel 3V, provide reliable and secure contact connections for customers around the world, and provide a richer experience for many contactless terminals in daily life. And excellent interoperability," said Stefan Streit, general manager of global marketing at TCL Communications.

"The high RF performance of ST's NFC solution maximizes freedom and flexibility to optimize new product designs," said Laurent Degauque, director of marketing at STMicroelectronics' Secure Microcontroller Division.

Related

NFC STMicroelectronics
Murata invest 29 billion yen to build new MLCC plant
Previous
Texas Instruments mass-produces radar chips
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diodes expands automotive bipolar transistor lineup for power control applications

Diodes expands automotive bipolar transistor lineup for power control applications

December 22, 2025
0
TDK launches HVC27*MC compact high-voltage DC contactor with mirror contact

TDK launches HVC27*MC compact high-voltage DC contactor with mirror contact

December 19, 2025
0
Vishay launches fast-acting thin film chip fuses for circuit protection

Vishay launches fast-acting thin film chip fuses for circuit protection

December 18, 2025
0
ROHM rolls out low-power DC motor driver ICs for appliance and industrial uses

ROHM rolls out low-power DC motor driver ICs for appliance and industrial uses

December 17, 2025
0
2
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator