Feb. 17, 2023 /SemiMedia/ -- According to reports, Texas Instruments announced that it will invest $11 billion to build a new 300mm wafer fab next to its existing factory in Lehi, Utah, USA.
Construction of the new fab is expected to start in the second half of 2023, with production starting in 2026 at the earliest. The fab will add about 800 new jobs, as well as thousands of indirect jobs.
"This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come," said Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer. "Our decision to build a second fab in Lehi underscores our commitment to Utah and is a testament to the talented team there who will lay the groundwork for another important chapter in TI's future. With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the CHIPS and Science Act, there is no better time to further invest in our internal manufacturing capacity."
The cost of the new fab is included in TI's previously announced capital expenditure plan to expand manufacturing capacity and will complement TI's existing 300mm fabs, including DMOS6 (Dallas), RFAB1 and RFAB2 (both located in Richardson, Texas) and LFAB (Lehi, Utah). TI is also building four new 300mm fabs in Sherman, Texas.
