SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Foxconn and Vedanta's joint-venture fab to start production in 2025
  • 0

Foxconn and Vedanta's joint-venture fab to start production in 2025

SemiMediaEdit
October 17, 2022

Vedanta Group recently revealed that its 28nm 12-inch wafer fab jointly built with Foxconn Technology Group is planned to be put into operation in 2025. The initial output will be 40,000 wafers per month, and full-speed production will begin in 2026.

According to reports, the joint venture company signed a memorandum of cooperation with the local government of Gujarat province, and will invest about US$20 billion to set up a factory there. The first phase is scheduled to be 400 acres of factory area, and will produce semiconductor chips and display glass in the first phase.

Related

electronic components news Foxconn Vedanta
TSMC: Inventory adjustment in chip supply chain may extend into first half of 2023
Previous
Microchip plans to expand production in Oregon
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Tower Semiconductor confirms it exited India fab project months ago

Tower Semiconductor confirms it exited India fab project months ago

May 20, 2025
0
TSMC plans wafer price hike, gains Nvidia’s support amid rising AI chip complexity

TSMC plans wafer price hike, gains Nvidia’s support amid rising AI chip complexity

May 20, 2025
0
Renesas launches RZ/A3M MPU with integrated memory for low-cost, high-performance HMI systems

Renesas launches RZ/A3M MPU with integrated memory for low-cost, high-performance HMI systems

May 20, 2025
0
TDK to accelerate silicon battery shipments for slimmer AI smartphones

TDK to accelerate silicon battery shipments for slimmer AI smartphones

May 19, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator