According to SEMI’s latest report, semiconductor manufacturers worldwide are forecast to expand 300mm fab capacity at a nearly 10% compound average growth rate (CAGR) from 2022 to 2025, reaching an all-time high of 9.2 million wafers per month (wpm). Strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions are driving much of the growth.
SEMI stated in the report that new fabs announced by companies including GlobalFoundries, Intel, Micron, Samsung, SkyWater Technology, TSMC and Texas Instruments are ramping in 2024 or 2025 to help meet the growth in demand.
“While shortages of some chips have eased and supply of others has remained tight, the semiconductor industry is laying the groundwork to meet longer-term demand for a broad range of emerging applications as it expands 300mm fab capacity,” said Ajit Manocha, SEMI President and CEO. “SEMI is currently tracking 67 new 300mm fabs or major additions of new lines expected to start construction from 2022 to 2025.”
SEMI pointed out that from 2021 to 2025, the 300mm Fab Outlook to 2025 shows Power-related capacity with the strongest growth at a 39% CAGR, followed by Analog at 37%, Foundry at 14%, Opto at 7% and Memory at 5%.
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