SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Nexperia introduces application-specific MOSFETs for automotive airbags
  • 0

Nexperia introduces application-specific MOSFETs for automotive airbags

SemiMediaEdit
May 13, 2022

Nexperia recently introduced a new portfolio of application specific MOSFETs (ASFETs) for automobile airbag applications, headlining with the release of the BUK9M20-60EL single N-channel 60 V, 13 mOhm logic level MOSFET in LFPAK33 packaging. ASFETs are MOSFETs that have been specifically designed and optimized for use in one application. This portfolio is the latest addition to a range of other ASFETs which Nexperia’s provides for battery isolation, motor control, hot-swap, and Power-over-Ethernet (PoE) applications.

The BUK9M20-60EL uses Nexperia’s new enhanced safe operating area (SOA) technology which has been tailored to provide exceptional transient linear mode performance, a key performance metric in airbag applications. The BUK9M20-60EL achieves this performance in new LFPAK33 packaging which uses 84% less board space when compared to older DPAK packaging, while still maintaining robustness.

“Other similar products use older DPAK packaging and are typically based on DMOS and first-generation trench technologies which are being gradually retired by many silicon manufacturers,” according to Norman Stapelberg, Senior Product Marketing Manager at Nexperia. “This portfolio of ASFETs uses a combination of the latest silicon trench technology and LFPAK packaging, allowing it to meet the most recent reliability standards. Using the latest manufacturing and packaging technologies makes the supply chain more sustainable and empowers Nexperia to increase capacity to meet the demands of a growing market for these products.”

For more details on the BUK9M20-60EL visit: https://www.nexperia.com/products/mosfets/automotive-mosfets/BUK9M20-60EL.html

Related

electronic components news Nexperia
Diodes Inc. introduces high efficiency low voltage 3A buck converter for high power density automotive designs
Previous
Okmetic to build new fab in Finland for SOI wafers
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron to phase out DDR4 as DRAM prices spike amid supply shift

Micron to phase out DDR4 as DRAM prices spike amid supply shift

June 16, 2025
0
Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator