SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK releases compact cylindrical DC-link capacitor for PCB mounting
  • 0

TDK releases compact cylindrical DC-link capacitor for PCB mounting

SemiMediaEdit
June 11, 2021

TDK Corporation recently introduced the new B32320I series of compact cylindrical DC link capacitors for mounting on PCBs. They are designed for voltages of 450 V DC to 1300 V DC and cover a capacitance range of 6.5 µF to 260 µF. The current handling capacity IRMS is up to 27.6 A (10 kHz, 60 °C) and minimal ESR is 2.4 mΩ. The new DC-link capacitors are designed for a maximum hotspot temperature of 105 °C. The plastic housing corresponds to UL 94 V-0.

Depending on the model, the dimensions are between 35 mm x 53 mm and 60 mm x 120 mm. Due to their relatively tall insertion height compared with cubic capacitors, the new DC-link capacitors have low footprint requirements on the PCB in relation to their capacity. All models in the new series feature five pins, which ensures high current capability as well as high stability on the PCB.

Typical areas of application include frequency converters for drives, converters for photovoltaic and air conditioning systems and critical UPS systems.

Main features and benefits

  • Rated voltage of 450 V DC to 1300 V DC
  • Capacitance range from 6.5 µF to 260 µF
  • Compact dimensions of 35 mm x 53 mm and 60 mm x 120 mm
  • Minimal space requirements on the PCB

More information please visit www.tdk-electronics.tdk.com/en/ac_capacitors.

Related

electronic components news TDK
Digi-Key and Rochester Electronics cooperate in the supply of components
Previous
SIA: Global semiconductor sales increase 1.9% month-to-month in April; annual sales projected to increase 19.7% in 2021, 8.8% in 2022
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Allegro to raise prices by at least 10% from late April

Allegro to raise prices by at least 10% from late April

March 27, 2026
0
Infineon rolls out XDPP1188-200C for AI server 800V power designs

Infineon rolls out XDPP1188-200C for AI server 800V power designs

March 27, 2026
0
Broadcom warns of supply limits as foundry capacity tightens

Broadcom warns of supply limits as foundry capacity tightens

March 26, 2026
0
Asus sees PC prices rising 25%–30% as chip costs increase

Asus sees PC prices rising 25%–30% as chip costs increase

March 26, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • Electronic components distributor
  • NXP

SemiMediaEdit

Administrator