SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK releases compact cylindrical DC-link capacitor for PCB mounting
  • 0

TDK releases compact cylindrical DC-link capacitor for PCB mounting

SemiMediaEdit
June 11, 2021

TDK Corporation recently introduced the new B32320I series of compact cylindrical DC link capacitors for mounting on PCBs. They are designed for voltages of 450 V DC to 1300 V DC and cover a capacitance range of 6.5 µF to 260 µF. The current handling capacity IRMS is up to 27.6 A (10 kHz, 60 °C) and minimal ESR is 2.4 mΩ. The new DC-link capacitors are designed for a maximum hotspot temperature of 105 °C. The plastic housing corresponds to UL 94 V-0.

Depending on the model, the dimensions are between 35 mm x 53 mm and 60 mm x 120 mm. Due to their relatively tall insertion height compared with cubic capacitors, the new DC-link capacitors have low footprint requirements on the PCB in relation to their capacity. All models in the new series feature five pins, which ensures high current capability as well as high stability on the PCB.

Typical areas of application include frequency converters for drives, converters for photovoltaic and air conditioning systems and critical UPS systems.

Main features and benefits

  • Rated voltage of 450 V DC to 1300 V DC
  • Capacitance range from 6.5 µF to 260 µF
  • Compact dimensions of 35 mm x 53 mm and 60 mm x 120 mm
  • Minimal space requirements on the PCB

More information please visit www.tdk-electronics.tdk.com/en/ac_capacitors.

Related

electronic components news TDK
Digi-Key and Rochester Electronics cooperate in the supply of components
Previous
SIA: Global semiconductor sales increase 1.9% month-to-month in April; annual sales projected to increase 19.7% in 2021, 8.8% in 2022
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK launches vibration-resistant hybrid polymer capacitors for automotive and industrial use

TDK launches vibration-resistant hybrid polymer capacitors for automotive and industrial use

December 12, 2025
0
Renesas launches RA6W Wi-Fi 6 MCUs and modules for low-power IoT applications

Renesas launches RA6W Wi-Fi 6 MCUs and modules for low-power IoT applications

December 11, 2025
0
Taiyo Yuden begins mass production of embeddable 100-μF MLCC for AI server power lines

Taiyo Yuden begins mass production of embeddable 100-μF MLCC for AI server power lines

December 10, 2025
0
TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges

TSMC speeds up U.S. advanced packaging plans as CoWoS demand surges

December 9, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator