SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Memory chip capacity can be increased by a factor of 1,000, a new discovery from a Korean team
  • 0

Memory chip capacity can be increased by a factor of 1,000, a new discovery from a Korean team

SemiMediaEdit
July 3, 2020

According to The Korea Herald report, a research team in South Korea has discovered a way to increase the storage capacity of memory chips by a factor of 1,000, while increasing the possibility of using 0.5 nanometer process technology.

The research team comes from the Ulsan National Institute of Science and Technology (UNIST) and is funded by the Samsung Science and Technology Foundation. The team’s latest discovery will enable chip manufacturers to use a new physical phenomenon to make smaller chips, and it is possible to expand data storage capacity by a factor of 1,000.

The report explained that the UNIST team’s research has found a way to control individual atoms in semiconductor materials and further increase the storage capacity of microchips and break the chip domain size limit.

The UNIST team found that by adding a drop of charge to a semiconductor material called ferroelectric hafnium oxide (HfO2), four individual atoms can be controlled to store 1 bit of data. This means that it is possible to store 500 TB of data per square centimeter in a flash memory module, which is 1,000 times that of current flash memory chips.

Related

electronic components news Memory chip capacity
Renesas adds leading power efficiency to its embedded controller RE series
Previous
STMicroelectronics expands STM32WL wireless MCU ecosystem with wM-Bus stack for smart metering from Stackforce
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung plans to phase out SATA SSDs, tightening consumer NAND supply

Samsung plans to phase out SATA SSDs, tightening consumer NAND supply

December 16, 2025
0
ADI announces price increase from February 2026

ADI announces price increase from February 2026

December 16, 2025
0
Kioxia plans 332-layer NAND output in Iwate to target AI data center demand

Kioxia plans 332-layer NAND output in Iwate to target AI data center demand

December 15, 2025
0
TE to raise connector prices from early 2026, impacting chip supply chain

TE to raise connector prices from early 2026, impacting chip supply chain

December 15, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator