March 13, 2026 /SemiMedia/ — Japan’s Rohm Semiconductor and Toshiba are in talks about combining their power semiconductor businesses, according to people familiar with the matter.

One option under discussion is setting up a joint venture that would hold the power semiconductor operations of both companies.

The talks come as Japanese chipmakers face stronger competition in the global market. Data from Omdia shows Toshiba and Rohm held about 2.6% and 2.5% of the global power semiconductor market in 2024, far behind industry leader Infineon Technologies with around 17.4%.

Separately, auto parts supplier Denso has reportedly proposed acquiring about 95% of Rohm in a deal that could reach roughly 1.3 trillion yen ($8.2 billion). Rohm is currently reviewing that proposal.

Rohm is known for automotive power chips, especially silicon carbide (SiC) devices, while Toshiba has a broad lineup of silicon-based power semiconductors and a large industrial customer base.