SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Nexperia names new CEO
  • 0

Nexperia names new CEO

SemiMediaEdit
March 25, 2020

Yesterday, Nexperia announced that CEO Frans Scheper has decided to take early retirement and will step down as Nexperia CEO and Management Board Member today. Frans Scheper will continue to serve as an advisor to the Chairman for a period of time to help achieve a smooth transition and provide continuity. At the same time, Xuezheng Zhang, currently Chairman of the Management Board of Nexperia, will assume the role of CEO.

Xuezheng Zhang is the founder and chairman of Wingtech. In December 2019, Wingtech completed the acquisition of 79.98% of Nexperia with 26.854 billion CNY - the largest semiconductor acquisition in China's history and the first time for a Chinese company to acquire a world-leading semiconductor company.

Frans Scheper indicated: “I am proud of what Nexperia has become and will miss the team. At the same time, I have decided not to seek a prolongation of my four-year tenure. Now is the time for Wingtech to decide on Nexperia’s future leadership.”

Xuezheng Zhang (Wing) indicates: “Frans has been key to the success of Nexperia. On behalf of the Board I want to thank him for what he has been for the Company. I am determined to work closely with the Executive Management Team. And I am happy Frans will help me in the next months as Special Advisor.”

Related

electronic components news Frans Scheper Nexperia CEO Xuezheng Zhang
ROHM Semiconductor announces partial operation of its Philippines and Malaysia factories
Previous
Samsung launches industry's first integrated power management chip for TWS earbuds
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

NXP launches UCODE X chip to support smaller RAIN RFID labels

NXP launches UCODE X chip to support smaller RAIN RFID labels

January 28, 2026
0
Counterpoint: AI server ASIC shipments seen tripling by 2027

Counterpoint: AI server ASIC shipments seen tripling by 2027

January 28, 2026
0
ROHM launches 500mA LDO regulators aimed at compact power designs

ROHM launches 500mA LDO regulators aimed at compact power designs

January 27, 2026
0
Prolonged cold raises power continuity concerns for Texas chip fabs

Prolonged cold raises power continuity concerns for Texas chip fabs

January 27, 2026
0
2
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator