SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Vishay introduces new automotive grade phototransistor optocoupler saves energy and space
  • 0

Vishay introduces new automotive grade phototransistor optocoupler saves energy and space

SemiMediaEdit
March 16, 2020

Vishay Intertechnology, Inc. recently introduced a new Automotive Grade phototransistor optocoupler that combines a high current transfer ratio (CTR) range from 50 % to 600 % with a low forward current of 1 mA in the compact SOP-4 mini-flat package.

Offering 80 % lower forward current than the previous-generation solution, the Vishay Semiconductors VOMA618A is designed to save energy in automotive and high reliability applications, while its low profile package saves board space. The AEC-Q101 qualified device is optimized for galvanic and noise isolation, signal transmission, battery management, 48 V boardnets, and system control in hybrid and electric vehicles.

The VOMA618A features a GaAlAs infrared emitting diode that is optically coupled to a silicon phototransistor. Its SOP-4 mini-flat package provides a 3750 V isolation voltage rating and creepage and clearance distance of ≥ 5 mm. Offering low coupling capacitance of 1.2 pF, the device is RoHS-compliant, halogen-free, and Vishay Green.

Samples and production quantities of the VOMA618A are available now, with standard lead times of four to six weeks. For more information please visit http://www.vishay.com/ppg?84949.

Related

Automotive Phototransistor Optocoupler electronic components news Vishsay VOMA618A
Silicon Labs announced acquisition of Redpine Signals' connectivity business to expand leading IoT wireless platform
Previous
Broadcom withdraws 2020 full year performance guidance
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

NXP launches UCODE X chip to support smaller RAIN RFID labels

NXP launches UCODE X chip to support smaller RAIN RFID labels

January 28, 2026
0
Counterpoint: AI server ASIC shipments seen tripling by 2027

Counterpoint: AI server ASIC shipments seen tripling by 2027

January 28, 2026
0
ROHM launches 500mA LDO regulators aimed at compact power designs

ROHM launches 500mA LDO regulators aimed at compact power designs

January 27, 2026
0
Prolonged cold raises power continuity concerns for Texas chip fabs

Prolonged cold raises power continuity concerns for Texas chip fabs

January 27, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator